Adopts high-quality 3D NAND wafer level chip. Supports PCIe3.0 x4 and NVMe 1.3 protocol. All-metal cooling plate is included; equipped with intelligent temperature control technology. Adopts TRIM to improve read/write performance and speed. Supports Max. Write technology for full-disk SLC cache. Supports LDPC ECC to enhance data reliability. Low power consumption management.


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